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W741C2008704H Search resultsC
Premium C
| Part # | Mfg | Datasheet | Description | Q'ty | Datacode | Location | Reg Date | Supplier | RFQ |
| W741C2001931 | WINBOND |
|
BGA | 20000 | 14-15+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
W741C2008704H
|
WINBOND |
|
NA | 30000 | 14-15+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
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W741C2010233
|
CHANGYOW |
|
DIP-18 | 629000 | 2022+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
|
W741C2400600H
|
WINBOND |
|
LUOPIAN | 629006 | 2022+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
| W741C2402250 | WINBOND |
|
NA | 12000 | 14-15+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
|
W741C2501225
|
WINBOND |
|
NA | 629001 | 2022+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
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W741C2600668
|
WINBOND |
|
DIE | 628997 | 2022+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
| W741C2600668 | WINBOND/ |
|
DIE | 45000 | 22+ | stock | 24-04-28 | HongKongTeyouHuichengElectronicTechnology Limited |
Inquiry
|
|
W741C2600970
|
WINBAND |
|
QFP | 18000 | 2016+ | Instock | 24-04-28 | IC Agent Electronics Ins |
Inquiry
|
| W741C2600970 | WINBAND |
|
QFP | 6685 | 2016 | Instock | 24-04-28 | FEDERAL INDUSTRY CO. |
Inquiry
|
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W741C2600974
|
WINBOND |
|
QFP | 18000 | 2016+ | Instock | 24-04-28 | IC Agent Electronics Ins |
Inquiry
|
| W741C2600974 | WINBOND |
|
QFP | 6685 | 2016 | Instock | 24-04-28 | FEDERAL INDUSTRY CO. |
Inquiry
|
|
W741C2601671
|
WINBOND |
|
DIE | 628996 | 2022+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
| W741C2601671 | WINBOND/ |
|
DIE | 45000 | 22+ | stock | 24-04-28 | HongKongTeyouHuichengElectronicTechnology Limited |
Inquiry
|
| W741C2601971 | WINBOND |
|
BGA | 20000 | 14-15+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
|
W741C2602164
|
WINBOND |
|
DIE | 629005 | 2022+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
|
W741C2607702H
|
WINBOND |
|
629004 | 2022+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
|
|
W741C2608221H
|
WINDBOND |
|
DIE | 628999 | 2022+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
| W741C2608221H | WINDBOND |
|
DIE | 45000 | 22+ | stock | 24-04-28 | HongKongTeyouHuichengElectronicTechnology Limited |
Inquiry
|
| W741C2608656 | WINBOND |
|
DIE | 8500 | n/a | Instock | 24-04-28 | IC Agent Electronics Ins |
Inquiry
|
| W741C2608656 | WINBOND |
|
DIE | 12500 | n/a | stockontime | 24-04-28 | FEDERAL INDUSTRY CO. |
Inquiry
|
|
W741C2608656
|
WINBOND |
|
05 | 629003 | 2022+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
|
W741C2609123H
|
WINBOND |
|
NA | 629002 | 2022+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
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W741C2609282H
|
WINDBOND |
|
DIE | 628998 | 2022+ | INSTOCK | 24-04-28 | Nego IC Co. |
Inquiry
|
| W741C2609282H | WINDBOND |
|
DIE | 45000 | 22+ | stock | 24-04-28 | HongKongTeyouHuichengElectronicTechnology Limited |
Inquiry
|
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