| Mfg |
Part # |
Datasheet |
Description |
 Turck, Inc. |
44067 |
1Mb/3P |
Inductive Sensor 11/07/2023 |
 Molex Electronics L... |
44067-0201 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") |
| 44067-0401 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB |
| 44067-0402 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB |
| 44067-0403 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 44067-0601 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating |
| 44067-0602 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm |
| 44067-0603 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") |
| 44067-0801 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") |
| 44067-0802 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick |
| 44067-1001 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") |
| 44067-1002 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") |
| 44067-1003 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") |
| 44067-1201 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating |
| 44067-1202 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB |
| 44067-1203 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 44067-1401 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB |
| 44067-1402 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header |
| 44067-1403 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 44067-1601 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") |
| 44067-1602 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB |
| 44067-1603 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 44067-1801 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 18 Circuits, Tin (Sn) Plating |
| 44067-1802 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB |
| 44067-1803 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header |
| 44067-2001 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 20 Circuits, Tin (Sn) Plating |
| 44067-2002 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140") Thick PCB, 2 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 44067-2201 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") |
| 44067-2401 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB |
| 44067-2402 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 24 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |