L1F stock, price, datasheet. – FEDERAL INDUSTRY CO.

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Part #	Mfg	Datasheet	Description	Q'ty	Datacode	Location	Reg Date	RFQ
L1F	NO		³¬Î¢-8½Å	17500	2016	Instock	26-11-03	Inquiry
L1F90011P00	EPSON			18361	20+PB	Pb-Free	26-11-03	Inquiry

L1F Datasheet

Mfg	Part #	Datasheet	Description
Lumileds Lighting C...	L1F3-U380200006000	1Mb/24P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U380200006000	1Mb/2P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U380200006000	1Mb/23P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology 20180531
	L1F3-U380200008000	1Mb/24P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U380200008000	1Mb/2P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U380200008000	1Mb/23P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology 20180531
	L1F3-U380200010000	1Mb/24P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U380200010000	1Mb/2P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U390200010000	1Mb/24P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U390200010000	1Mb/2P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U390200012000	1Mb/24P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U390200012000	1Mb/2P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U390200012000	1Mb/23P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology 20180531
	L1F3-U400200010000	1Mb/24P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U400200010000	1Mb/2P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U400200012000	1Mb/24P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U400200012000	1Mb/2P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U400200012000	1Mb/23P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology 20180531
	L1F3-U400200014000	1Mb/24P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U400200014000	1Mb/2P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U410200012000	1Mb/24P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U410200012000	1Mb/2P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U410200014000	1Mb/24P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U410200014000	1Mb/2P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology
	L1F3-U410200014000	1Mb/23P	Highest power density, superior efficiency, powered by leading Chip Scale Package (CSP) technology 20180531