879141016 stock, price, datasheet. – FEDERAL INDUSTRY CO.

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SANKEY SHARE CO.,LIMITED ANKEY ELECTRONICS CO.,LTD Renxim Electronic Limited. SemiLex Electronics Inc. bright spot technology development co.,ltd SANKEY SHARE CO.,LIMITED SANKEY SHARE CO.,LIMITED MicrotranikComponents,Inc TIMICOMM Electronics Semilex Distributor fenkey electronics co.,ltd fenyang electronics co.,ltd Fengyangxin Technology ( HK ) Co.,Ltd HongDaElectronicsCo.LTD Transcrui Microcircuit Corporation Evatronix(HK) Electronics Trade Inc KANKEY ELECTRONICS CO.,LTD Semilex Electronics Direct Unitronix Electronics Inc. pulkey electronics ( HK ) co.,ltd SANKEY SHARE CO.,LIMITED SANKEY SHARE CO., LIMITED Unitronix Electronics Limited sanyinic electronics ( h k ) co.,ltd Evatronix(HK) Technology Limited

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Part #	Mfg	Datasheet	Description	Q'ty	Datacode	Location	Reg Date	RFQ
879141246	MOLEX		NA	210000	20+PB	Pb-Free	26-10-12	Inquiry

879141016 Datasheet

Mfg	Part #	Datasheet	Description
Molex Electronics L...	87914-0009	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 6 Circuits, Gold (Au) Flash Overall Plating, Tray Packaging, Lead-free
	87914-0216	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 2 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-0616	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 6 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-0806	770Kb/11P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-0807	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54關m (100關) Tin (Sn) Overall Plating, Tray Packaging
	87914-0816	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-1016	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-1216	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 12 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-1416	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-1616	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-1816	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-2016	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 20 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-2216	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-2416	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 24 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-2616	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-2815	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
	87914-2816	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-3016	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-3203	770Kb/11P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 2.54關m (1.00關) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
	87914-3216	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-3416	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-3435	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
	87914-3616	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-3816	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 38 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-4016	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 40 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-4201	770Kb/11P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
	87914-4216	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-4405	4Mb/57P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
	87914-4416	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	87914-4616	3Mb/48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 46 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free