4406 stock, price, datasheet. – FEDERAL INDUSTRY CO.

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Part #	Mfg	Datasheet	Description	Q'ty	Datacode	Location	Reg Date	RFQ
4406	AOFCK		SOP-8	5918234	20+PB	Pb-Free	26-09-24	Inquiry
4406-10SR	MULTICOMP			5119485	20+PB	Pb-Free	26-09-24	Inquiry
4406-20SR	MULTICOMP			4193203	20+PB	Pb-Free	26-09-24	Inquiry
4406-34SR	MULTICOMP			2486036	20+PB	Pb-Free	26-09-24	Inquiry
4406-50SR	MULTICOMP			1600760	20+PB	Pb-Free	26-09-24	Inquiry
440671203	MOLEX			28406	20+PB	Pb-Free	26-09-24	Inquiry
440680004	MOLEM		SMD	2800	20+PB	Pb-Free	26-09-24	Inquiry
440680045	MOLEX			9226	20+PB	Pb-Free	26-09-24	Inquiry
440680050	MOLEX			9926	20+PB	Pb-Free	26-09-24	Inquiry
44068-0001	MOLEX		NA	210	20+PB	Pb-Free	26-09-24	Inquiry
44068-0004	MOLEM		SMD	2800	20+PB	Pb-Free	26-09-24	Inquiry

4406 Datasheet

Mfg	Part #	Datasheet	Description
Heyco.	4406	70Kb/1P	Push Rivet-Arrow
List of Unclassifed...	44060	104Kb/1P	PRIMARY VOLTAGE, Vacuum filling, Two compartments bobbins
List of Unclassifed...	4406000400	2Mb/164P	We are Dedicated to Achieving Customer Satisfaction Through Continuous Improvement
Turck, Inc.	44065	1Mb/3P	Inductive Sensor 11/07/2023
	4406551	1Mb/3P	Inductive Sensor 11/07/2023
	44067	1Mb/3P	Inductive Sensor 11/07/2023
Molex Electronics L...	44067-0201	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
	44067-0401	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
	44067-0402	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
	44067-0403	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
	44067-0601	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
	44067-0602	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
	44067-0603	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
	44067-0801	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
	44067-0802	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
	44067-1001	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
	44067-1002	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
	44067-1003	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
	44067-1201	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating
	44067-1202	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
	44067-1203	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
	44067-1401	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
	44067-1402	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header
	44067-1403	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
	44067-1601	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
	44067-1602	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
	44067-1603	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
	44067-1801	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 18 Circuits, Tin (Sn) Plating
	44067-1802	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
	44067-1803	216Kb/3P	3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header