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0015804 Search results
Supplier
TIMICOMM Electronics Semilex Distributor Evatronix(HK) Electronics Trade Inc Semilex Electronics Direct Unitronix Electronics Inc. YI FENG Electronics Inc. Transcrui Microcircuit Corporation SemiLex Electronics Inc. Microtranik_Components.,Inc LEOSNA IC TRADING CO. NegoICCo.
Premium B
Total: 3
( 1/1 Page)
info
FEDERAL INDUSTRY CO.
Singapore
Tess@sunnlyic.com
Part # Mfg Datasheet Description Q'ty Datacode Location Reg Date RFQ
001524-6140 MOLEX 001524-6140 datasheet SMD 10080 20+PB Pb-Free 26-09-19
Inquiry
001524-6140 inquiry
0015911608ND RoHs 0015911608ND datasheet Original&New 15000 2016 Instock 26-09-19
Inquiry
0015911608ND inquiry
0000-0002-0015 DILCO 0000-0002-0015 datasheet 4361 20+PB Pb-Free 26-09-19
Inquiry
0000-0002-0015 inquiry
1
0015804 Datasheet
Mfg Part # Datasheet Description
logo
Molex Electronics L...
001580-0307 MOLEX2-001580-0307 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
001580-0407 MOLEX2-001580-0407 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
001580-0489 MOLEX2-001580-0489 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
001580-1123 MOLEX1-001580-1123 Datasheet
32Kb/2P
   2.54mm Pitch C-Grid짰 Header
001580-1143 MOLEX1-001580-1143 Datasheet
32Kb/2P
   2.54mm Pitch C-Grid짰 Header
001580-1163 MOLEX1-001580-1163 Datasheet
31Kb/2P
   2.54mm Pitch C-Grid짰 Header
001580-1181 MOLEX2-001580-1181 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
001580-1241 MOLEX2-001580-1241 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
001580-1261 MOLEX2-001580-1261 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
001580-1321 MOLEX2-001580-1321 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
001580-1324 MOLEX1-001580-1324 Datasheet
31Kb/2P
   2.54mm Pitch C-Grid짰 Header
001580-1341 MOLEX2-001580-1341 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
001580-1361 MOLEX2-001580-1361 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
0015800061 MOLEX2-0015800061 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
0015800061_17 MOLEX1-0015800061_17 Datasheet
33Kb/2P
   2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800063 MOLEX2-0015800063 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0015800063_17 MOLEX1-0015800063_17 Datasheet
33Kb/2P
   2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800065 MOLEX2-0015800065 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0015800065_17 MOLEX1-0015800065_17 Datasheet
33Kb/2P
   2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800067 MOLEX2-0015800067 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
0015800067_17 MOLEX1-0015800067_17 Datasheet
33Kb/2P
   2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800069 MOLEX2-0015800069 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
0015800069_17 MOLEX1-0015800069_17 Datasheet
33Kb/2P
   2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800081 MOLEX2-0015800081 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
0015800081_17 MOLEX1-0015800081_17 Datasheet
33Kb/2P
   2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800083 MOLEX2-0015800083 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
0015800083_17 MOLEX1-0015800083_17 Datasheet
33Kb/2P
   2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800085 MOLEX2-0015800085 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
0015800085_17 MOLEX1-0015800085_17 Datasheet
33Kb/2P
   2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
0015800087 MOLEX2-0015800087 Datasheet
1Mb/7P
   2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating