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GT25H32DP2.2V Search results
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IC Agent Electronics Ins
USA
Kevin@ic-agent.com
| Part # | Mfg | Datasheet | Description | Q'ty | Datacode | Location | Reg Date | RFQ |
GT25H-2024SCF
|
HIROSE |
|
800000 | 2020+ | Instock | 26-10-05 |
Inquiry
|
|
| GT25H-32DP-2.2V | HIROSE |
|
Connector | 73010 | 2020+ | Instock | 26-10-05 |
Inquiry
|
| GT25H2-8DP-2.2H | HIROSE |
|
Connector | 77210 | 2020+ | Instock | 26-10-05 |
Inquiry
|
| GT25H2-16DP-2.2H | HIROSE |
|
Connector | 72170 | 2020+ | Instock | 26-10-05 |
Inquiry
|
| GT25H2-40DP-2.2H | HIROSE |
|
Connector | 77630 | 2020+ | Instock | 26-10-05 |
Inquiry
|
| GT25H-12DP-2.2H(33) | Hirose/Hir |
|
700 | 2020+ | Instock | 26-10-05 |
Inquiry
|
1
GT25H32DP2.2V Datasheet
| Mfg | Part # | Datasheet | Description |
 Hirose Electric |
GT25H-12DP-2.2H |
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting. |
| GT25H-12DP-2.2V |
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting. | |
| GT25H-2024SCF |
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting. | |
| GT25H-20DP-2.2H |
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting. | |
| GT25H-24DP-2.2H |
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting. | |
| GT25H-24DP-2.2V |
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting. | |
| GT25H-32DP-2.2H |
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting. | |
| GT25H-32DP-2.2V |
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting. | |
 Toshiba Semiconduct... |
GT25H101 |
835Kb/16P |
Discrete IGBTs |
|
Hirose Electric |
GT25HB-2428SCF |
246Kb/5P |
Metal holddowns to solder by reflow are used instead of screws for PCB mounting. |