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IC Agent Electronics Ins
USA
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| Part # | Mfg | Datasheet | Description | Q'ty | Datacode | Location | Reg Date | RFQ |
4MCM226MATER
|
NIPPON |
|
SMD | 556080 | 2020+ | Instock | 26-09-28 |
Inquiry
|
1
4MCM226MATER Datasheet
| Mfg | Part # | Datasheet | Description |
 RMT Ltd. |
4MC04-115-05 |
417Kb/4P |
Thermoelectric Module |
| 4MC04-115-05 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC04-115-05_12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC04-115-08 |
417Kb/4P |
Thermoelectric Module | |
| 4MC04-115-08 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC04-115-10 |
417Kb/4P |
Thermoelectric Module | |
| 4MC04-115-10 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC04-115-12 |
417Kb/4P |
Thermoelectric Module | |
| 4MC04-115-12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC04-115-15 |
417Kb/4P |
Thermoelectric Module | |
| 4MC04-115-15 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC04115 |
2Mb/8P |
Thermoelectric Cooling Solutions | |
| 4MC06-103-05 |
250Kb/4P |
Thermoelectric Module | |
| 4MC06-103-05 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC06-103-05_12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC06-103-08 |
250Kb/4P |
Thermoelectric Module | |
| 4MC06-103-08 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC06-103-10 |
250Kb/4P |
Thermoelectric Module | |
| 4MC06-103-10 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC06-103-12 |
250Kb/4P |
Thermoelectric Module | |
| 4MC06-103-12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC06-103-15 |
250Kb/4P |
Thermoelectric Module | |
| 4MC06-103-15 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC06-105-03 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC06-105-03 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC06-105-03_1 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC06-105-05 |
437Kb/4P |
Thermoelectric Module | |
| 4MC06-105-05 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC06-105-05 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 4MC06-105-05-1 |
251Kb/4P |
Thermoelectric Module |