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3MDSD6840A Search results
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| Part # | Mfg | Datasheet | Description | Q'ty | Datacode | Location | Reg Date | RFQ |
| 3MDSD6840A | ADI/ |
|
DIP-20 | 6840 | 2020+ | Instock | 26-10-04 |
Inquiry
|
1
3MDSD6840A Datasheet
| Mfg | Part # | Datasheet | Description |
 RMT Ltd. |
3MD04-071-05 |
459Kb/4P |
Thermoelectric Module |
| 3MD04-071-05 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-071-05 |
2Mb/8P |
Metallized (Au plating) | |
| 3MD04-071-05_12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-071-08 |
459Kb/4P |
Thermoelectric Module | |
| 3MD04-071-08 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-071-08 |
2Mb/8P |
Metallized (Au plating) | |
| 3MD04-071-10 |
459Kb/4P |
Thermoelectric Module | |
| 3MD04-071-10 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-071-10 |
2Mb/8P |
Metallized (Au plating) | |
| 3MD04-071-12 |
459Kb/4P |
Thermoelectric Module | |
| 3MD04-071-12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-071-12 |
2Mb/8P |
Metallized (Au plating) | |
| 3MD04-071-15 |
459Kb/4P |
Thermoelectric Module | |
| 3MD04-071-15 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-071-15 |
2Mb/8P |
Metallized (Au plating) | |
| 3MD04-113-05 |
455Kb/4P |
Thermoelectric Module | |
| 3MD04-113-05 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-113-05 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 3MD04-113-05_12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-113-08 |
455Kb/4P |
Thermoelectric Module | |
| 3MD04-113-08 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-113-08 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 3MD04-113-10 |
455Kb/4P |
Thermoelectric Module | |
| 3MD04-113-10 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-113-10 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 3MD04-113-12 |
455Kb/4P |
Thermoelectric Module | |
| 3MD04-113-12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-113-12 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 3MD04-113-15 |
455Kb/4P |
Thermoelectric Module |