3MD1M1QE stock, price, datasheet. – IC Agent Electronics Ins

3MD1M1QE Search results

Premium Supplier

Element14

IC Agent Electronics Ins

FEDERAL INDUSTRY CO.

Supplier

SemiLex Electronics Inc. MicrotranikComponents,Inc Obama Resources Group IC INTERNATIONAL TRADING CO. Transcrui Microcircuit Corporation Evatronix(HK) Technology Limited Kairong Electronics Ltd. Microtranik_Components.,Inc LEOSNA IC TRADING CO.

By Stock Alphabetical

Premium B

Total: 1

( 1/1 Page)

info

IC Agent Electronics Ins

USA

Kevin@ic-agent.com

Part #	Mfg	Datasheet	Description	Q'ty	Datacode	Location	Reg Date	RFQ
3MDSD6840A	ADI/		DIP-20	6840	2020+	Instock	26-10-10	Inquiry

3MD1M1QE Datasheet

Mfg	Part #	Datasheet	Description
RMT Ltd.	3MD04-071-05	459Kb/4P	Thermoelectric Module
	3MD04-071-05	2Mb/8P	Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
	3MD04-071-05	2Mb/8P	Metallized (Au plating)
	3MD04-071-05_12	2Mb/8P	Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
	3MD04-071-08	459Kb/4P	Thermoelectric Module
	3MD04-071-08	2Mb/8P	Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
	3MD04-071-08	2Mb/8P	Metallized (Au plating)
	3MD04-071-10	459Kb/4P	Thermoelectric Module
	3MD04-071-10	2Mb/8P	Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
	3MD04-071-10	2Mb/8P	Metallized (Au plating)
	3MD04-071-12	459Kb/4P	Thermoelectric Module
	3MD04-071-12	2Mb/8P	Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
	3MD04-071-12	2Mb/8P	Metallized (Au plating)
	3MD04-071-15	459Kb/4P	Thermoelectric Module
	3MD04-071-15	2Mb/8P	Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
	3MD04-071-15	2Mb/8P	Metallized (Au plating)
	3MD04-113-05	455Kb/4P	Thermoelectric Module
	3MD04-113-05	2Mb/8P	Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
	3MD04-113-05	2Mb/8P	Blank ceramics (not metallized)
	3MD04-113-05_12	2Mb/8P	Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
	3MD04-113-08	455Kb/4P	Thermoelectric Module
	3MD04-113-08	2Mb/8P	Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
	3MD04-113-08	2Mb/8P	Blank ceramics (not metallized)
	3MD04-113-10	455Kb/4P	Thermoelectric Module
	3MD04-113-10	2Mb/8P	Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
	3MD04-113-10	2Mb/8P	Blank ceramics (not metallized)
	3MD04-113-12	455Kb/4P	Thermoelectric Module
	3MD04-113-12	2Mb/8P	Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
	3MD04-113-12	2Mb/8P	Blank ceramics (not metallized)
	3MD04-113-15	455Kb/4P	Thermoelectric Module