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2MD6T2B2M6RE Search results
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IC Agent Electronics Ins
USA
Kevin@ic-agent.com
| Part # | Mfg | Datasheet | Description | Q'ty | Datacode | Location | Reg Date | RFQ |
| 2MD0116 | N/A |
|
SOP | 18000 | 2016+ | Instock | 26-10-08 |
Inquiry
|
| 2MDU62H256SK | N/A |
|
SOP | 18000 | 2016+ | Instock | 26-10-08 |
Inquiry
|
1
2MD6T2B2M6RE Datasheet
| Mfg | Part # | Datasheet | Description |
 RMT Ltd. |
2MD04-014-05 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
| 2MD04-014-05 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 2MD04-014-08 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 2MD04-014-08 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 2MD04-014-10 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 2MD04-014-10 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 2MD04-014-12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 2MD04-014-12 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 2MD04-014-15 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 2MD04-014-15 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 2MD04-022-05 |
334Kb/4P |
Thermoelectric Module | |
| 2MD04-022-05 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 2MD04-022-05 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 2MD04-022-05-1 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 2MD04-022-05/1 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 2MD04-022-05_12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 2MD04-022-08 |
334Kb/4P |
Thermoelectric Module | |
| 2MD04-022-08 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 2MD04-022-08 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 2MD04-022-08-1 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 2MD04-022-08/1 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 2MD04-022-10 |
334Kb/4P |
Thermoelectric Module | |
| 2MD04-022-10 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 2MD04-022-10 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 2MD04-022-10-1 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 2MD04-022-10/1 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 2MD04-022-12 |
334Kb/4P |
Thermoelectric Module | |
| 2MD04-022-12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 2MD04-022-12 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 2MD04-022-12-1 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |