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3MD3M1QE Search results
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Element14
| Part # | Mfg | Datasheet | Description | RoHS | Q'ty | Price | Buy Now |
3MD3M1QE
|
MULTICOMP PRO |  |
SWITCH BODY, DPDT; For Use With:-; Product Range:-; SVHC:No SVHC (15-Jan-2018); Actuator / Cap Colou | ROHS COMPLIANT | 1+ : $2.77 12+ : $2.48 100+ : $2.27 500+ : $2.15 1000+ : $1.98 |
Buy Now
|
1
3MD3M1QE Datasheet
| Mfg | Part # | Datasheet | Description |
 RMT Ltd. |
3MD04-071-05 |
459Kb/4P |
Thermoelectric Module |
| 3MD04-071-05 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-071-05 |
2Mb/8P |
Metallized (Au plating) | |
| 3MD04-071-05_12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-071-08 |
459Kb/4P |
Thermoelectric Module | |
| 3MD04-071-08 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-071-08 |
2Mb/8P |
Metallized (Au plating) | |
| 3MD04-071-10 |
459Kb/4P |
Thermoelectric Module | |
| 3MD04-071-10 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-071-10 |
2Mb/8P |
Metallized (Au plating) | |
| 3MD04-071-12 |
459Kb/4P |
Thermoelectric Module | |
| 3MD04-071-12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-071-12 |
2Mb/8P |
Metallized (Au plating) | |
| 3MD04-071-15 |
459Kb/4P |
Thermoelectric Module | |
| 3MD04-071-15 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-071-15 |
2Mb/8P |
Metallized (Au plating) | |
| 3MD04-113-05 |
455Kb/4P |
Thermoelectric Module | |
| 3MD04-113-05 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-113-05 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 3MD04-113-05_12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-113-08 |
455Kb/4P |
Thermoelectric Module | |
| 3MD04-113-08 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-113-08 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 3MD04-113-10 |
455Kb/4P |
Thermoelectric Module | |
| 3MD04-113-10 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-113-10 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 3MD04-113-12 |
455Kb/4P |
Thermoelectric Module | |
| 3MD04-113-12 |
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper | |
| 3MD04-113-12 |
2Mb/8P |
Blank ceramics (not metallized) | |
| 3MD04-113-15 |
455Kb/4P |
Thermoelectric Module |