| Mfg |
Part # |
Datasheet |
Description |
 Bel Fuse Inc. |
0462-0025-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
| 0462-0030-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
| 0462-0035-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
| 0462-0040-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
| 0462-0045-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
| 0462-0050-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
| 0462-0060-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
| 0462-0070-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
| 0462-0080-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
| 0462-0090-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
| 0462-0100-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
| 0462-0150-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
| 0462-0200-02 |
56Kb/1P |
5 TAP LEADING EDGE CONTROL STANDARD DELAY MODULES |
 List of Unclassifed... |
0462-201-20141 |
1Mb/8P |
HD30 & HDP20 Series Technical Manual |
 TE Connectivity Ltd |
0462-201-2031 |
1Mb/26P |
DT Highspeed DT Highspeed 07 MAR 2023 Rev. B |
 Molex Electronics L... |
0462070004 |
295Kb/4P |
4.20mm (.165") Pitch Mini-Fit RTC??Reflow High Temperature Compatible Header,Dual Row, Vertical, 4 Circuits, 1.57mm (.062") PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating |
| 0462070004_18 |
32Kb/2P |
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical |
| 0462070006 |
295Kb/4P |
4.20mm (.165") Pitch Mini-Fit RTC Reflow High Temperature Compatible Header, Dual Row, Vertical, 6 |
| 0462070006_18 |
32Kb/2P |
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical |
| 0462070008 |
295Kb/4P |
4.20mm (.165") Pitch Mini-Fit RTC Reflow High Temperature Compatible Header, Dual Row, Vertical, 8 Circuits |
| 0462070008_18 |
32Kb/2P |
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical |
| 0462070010 |
295Kb/4P |
4.20mm (.165") Pitch Mini-Fit RTC??Reflow High Temperature Compatible Header,Dual Row, Vertical, 10 Circuits, 1.57mm (.062") PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating |
| 0462070010_18 |
32Kb/2P |
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical |
| 0462070012 |
295Kb/4P |
4.20mm (.165") Pitch Mini-Fit RTC Reflow High Temperature Compatible Header, Dual Row, Vertical |
| 0462070012_18 |
32Kb/2P |
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical |
| 0462070024 |
295Kb/4P |
4.20mm (.165") Pitch Mini-Fit RTC??Reflow High Temperature Compatible Header, Dual Row, Vertical, 24 Circuits, 1.57mm (.062") PCB Thickness, with PCB Pegs |
| 0462070024_18 |
31Kb/2P |
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical |
| 0462070104 |
31Kb/2P |
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical |
| 0462070104_18 |
31Kb/2P |
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical |
| 0462070106 |
31Kb/2P |
4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable, Tray Header, Dual Row, Vertical |