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W25Q256FVBIP Procurar Resultados
Premium Fornecedor
Fornecedor
HongDaElectronicsCo.LTD
Shenzhen Augswan Electronics Co., LTD.
TIMICOMM Electronics
Semilex Distributor
Transcrui Microcircuit Corporation
Evatronix(HK) Electronics Trade Inc
IC Agent Electronics Ins
CHINA KAIVO ELECTRONICS CO.,LTD
LENKEY ELECTRONICS (HK) CO.,LTD
Lvangchip(HongKong).,Limited
Semilex Electronics Direct
Unitronix Electronics Inc.
YI FENG Electronics Inc.
ePartronics
HongDa Electronics Co.,Ltd
Kynix Semiconductor Hong Kong Limited
Huahui Electron
Yiner(Shenzhen)Electronics Co., Ltd.
NegoICCo.
Premium A
Element14
| Número da peça | Mfg | Ficha de dados | Descrição | Rohs | Q'ty | Preço | Comprar agora |
W2503
|
PERFORMANCE TOOLS |  |
Impact Driver Set; Kit Contents:Screwdri; Impact Driver Set; Kit Contents:Screwdriver Set(Phillips, | NOT APPLICABLE | 1+ : $29.12 |
Comprar agora
|
Premium B
info
FEDERAL INDUSTRY CO.
Singapore
Tess@sunnlyic.com
| Número da peça | Mfg | Ficha de dados | Descrição | Q'ty | Datacode | Localização | Reg Data | RFQ |
| W25Q256FVEG | WINBOND |
|
WSON8 | 602 | 20+PB | Pb-Free | 26-10-06 |
Investigação
|
| W25Q256FVEQ | WINBOND |
|
WSON8 | 4683 | 20+PB | Pb-Free | 26-10-06 |
Investigação
|
| W25Q256FVFG | WINBOND |
|
SOP | 7 | 20+PB | Pb-Free | 26-10-06 |
Investigação
|
| W25Q256FVCIG | WINBOND |
|
BGA | 1190 | 20+PB | Pb-Free | 26-10-06 |
Investigação
|
| W25Q256FVCIP | WINBOND |
|
BGA | 1190 | 20+PB | Pb-Free | 26-10-06 |
Investigação
|
info
IC Agent Electronics Ins
USA
Kevin@ic-agent.com
| Número da peça | Mfg | Ficha de dados | Descrição | Q'ty | Datacode | Localização | Reg Data | RFQ |
| W25Q256FVBIP | WINBOND |
|
24-TFBGA6x8 | 357 | 20+PB | Pb-Free | 26-10-06 |
Investigação
|
| W25Q256FVBIPTR | WINBOND |
|
24-TFBGA6x8 | 357 | 20+PB | Pb-Free | 26-10-06 |
Investigação
|
Básico
| Fornecedor | Número da peça | Mfg | Ficha de dados | Descrição | Q'ty | Datacode | Localização | Reg Data | RFQ |
| Shenzhen Augswan Electronics Co., LTD. | W25Q256FVBIP | Winbond El |
|
IC FLASH 256M SPI 24TFBGA | 20698 | 21+ | Stock | 2023-07-25 |
Investigação
|
| TIMICOMM Electronics [ info@timicomm.com ] | W25Q256FVBIP | Winbond |
|
FLASH 256M SPI 24TFBGA | 86500 | 2022+ | NEW STOCK | 2026-01-06 |
Investigação
|
| Semilex Distributor [ sales@semi-lex.com ] | W25Q256FVBIP | Winbond |
|
FLASH 256M SPI 24TFBGA | 188600 | 2019+ | Can ship immediately | 2024-09-25 |
Investigação
|
| ePartronics | W25Q256FVBIP |
|
110 | 2025-07-25 |
Investigação
|
||||
| HongDa Electronics Co.,Ltd | W25Q256FVBIP | WINBOND |
|
BGA | 15880 | 2016 | In.USA.Stock | 2016-07-29 |
Investigação
|
| HongDaElectronicsCo.LTD |
W25Q256FVBIP
|
Winbond El |
|
IC FLASH 256M SPI 24TFBGA | 45120 | 2022 | In.USA.Stock | 2023-05-23 |
Investigação
|
| Transcrui Microcircuit Corporation | W25Q256FVBIP | Winbond |
|
FLASH 256M SPI 24TFBGA | 31783 | 2022+ | Original instock，Rush delivery | 2024-09-23 |
Investigação
|
| Evatronix(HK) Electronics Trade Inc | W25Q256FVBIP | Winbond |
|
FLASH 256M SPI 24TFBGA | 26198 | 2020+ | HOT SALES & GLOBAL | 2024-09-24 |
Investigação
|
| IC Agent Electronics Ins | W25Q256FVBIP | WINBOND |
|
24-TFBGA6x8 | 357 | 20+PB | Pb-Free | 2022-10-29 |
Investigação
|
| CHINA KAIVO ELECTRONICS CO.,LTD | W25Q256FVBIP | WinbondEle |
|
24-TFBGA(6x8) | 18000 | 19+ | 2026-09-29 |
Investigação
|
|
| Kynix Semiconductor Hong Kong Limited | W25Q256FVBIP | WINBOND |
|
1280 | 12+ | Stock | 2016-03-23 |
Investigação
|
|
| LENKEY ELECTRONICS (HK) CO.,LTD | W25Q256FVBIP | WinbondEle |
|
24-TFBGA(6x8) | 26600 | 16+ | 2026-10-02 |
Investigação
|
|
| Lvangchip(HongKong).,Limited | W25Q256FVBIP | WinbondEle |
|
SMD/DIP | 18800 | 23+ | Stock | 2024-03-06 |
Investigação
|
| Semilex Electronics Direct [ info@semi-lex.com ] | W25Q256FVBIP | Winbond |
|
FLASH 256M SPI 24TFBGA | 188600 | 2020+ | Can ship immediately | 2026-09-29 |
Investigação
|
| Unitronix Electronics Inc. [sales@unitronix-e.com] | W25Q256FVBIP | Winbond |
|
FLASH 256M SPI 24TFBGA | 46210 | 2020+ | HOT SALES | 2026-01-06 |
Investigação
|
| Huahui Electron | W25Q256FVBIP |
|
1157 | 2016-05-24 |
Investigação
|
||||
| YI FENG Electronics Inc. | W25Q256FVBIP | Winbond |
|
FLASH 256M SPI 24TFBGA | 42668 | 2022+ | New Stock,Rapid delivery | 2024-09-23 |
Investigação
|
| Yiner(Shenzhen)Electronics Co., Ltd. | W25Q256FVBIP | WINBOND |
|
BGA | 959500 | 15+ | 959500 | 2017-06-10 |
Investigação
|
| Shenzhen Augswan Electronics Co., LTD. | W25Q256FVBIP TR | Winbond El |
|
IC FLASH 256M SPI 24TFBGA | 8504 | 21+ | Stock | 2023-07-25 |
Investigação
|
| TIMICOMM Electronics [ info@timicomm.com ] | W25Q256FVBIP TR | Winbond |
|
FLASH 256M SPI 24TFBGA | 86500 | 2022+ | NEW STOCK | 2026-01-06 |
Investigação
|
| Semilex Distributor [ sales@semi-lex.com ] | W25Q256FVBIP TR | Winbond |
|
FLASH 256M SPI 24TFBGA | 189000 | 2019+ | Can ship immediately | 2024-09-25 |
Investigação
|
| HongDaElectronicsCo.LTD | W25Q256FVBIP TR | Winbond El |
|
IC FLASH 256M SPI 24TFBGA | 45120 | 2022 | In.USA.Stock | 2023-05-23 |
Investigação
|
| Transcrui Microcircuit Corporation | W25Q256FVBIP TR | Winbond |
|
FLASH 256M SPI 24TFBGA | 62526 | 2022+ | Original instock，Rush delivery | 2024-09-23 |
Investigação
|
| Evatronix(HK) Electronics Trade Inc | W25Q256FVBIP TR | Winbond |
|
FLASH 256M SPI 24TFBGA | 29461 | 2020+ | HOT SALES & GLOBAL | 2024-09-24 |
Investigação
|
| Semilex Electronics Direct [ info@semi-lex.com ] | W25Q256FVBIP TR | Winbond |
|
FLASH 256M SPI 24TFBGA | 189000 | 2020+ | Can ship immediately | 2026-09-29 |
Investigação
|
| Unitronix Electronics Inc. [sales@unitronix-e.com] | W25Q256FVBIP TR | Winbond |
|
FLASH 256M SPI 24TFBGA | 46610 | 2020+ | HOT SALES | 2026-01-06 |
Investigação
|
| YI FENG Electronics Inc. | W25Q256FVBIP TR | Winbond |
|
FLASH 256M SPI 24TFBGA | 45479 | 2022+ | New Stock,Rapid delivery | 2024-09-23 |
Investigação
|
| NegoICCo. |
W25Q256FVBIPTR
|
WINBOND |
|
24-TFBGA6x8 | 10000 | 2022+ | INSTOCK | 2026-08-21 |
Investigação
|
| HongDaElectronicsCo.LTD | W25Q256FVBIPTR | WinbondEle |
|
ICFLASH256MSPI24TFBGA | 45120 | 2020 | In.USA.Stock | 2023-05-23 |
Investigação
|
| IC Agent Electronics Ins | W25Q256FVBIPTR | WINBOND |
|
24-TFBGA6x8 | 357 | 20+PB | Pb-Free | 2022-10-29 |
Investigação
|
| CHINA KAIVO ELECTRONICS CO.,LTD | W25Q256FVBIPTR | WinbondEle |
|
24-TFBGA(6x8) | 18000 | 19+ | 2026-09-29 |
Investigação
|
|
| LENKEY ELECTRONICS (HK) CO.,LTD | W25Q256FVBIPTR | WinbondEle |
|
24-TFBGA(6x8) | 56230 | 17+ | 2026-10-02 |
Investigação
|
|
| Lvangchip(HongKong).,Limited | W25Q256FVBIPTR | WinbondEle |
|
SMD/DIP | 18800 | 23+ | Stock | 2024-03-06 |
Investigação
|
1
W25Q256FVBIP Ficha de dados
| Mfg | Número da peça | Ficha de dados | Descrição |
 Winbond |
W25Q256FVBIF |
1Mb/108P |
3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q256FVBIF-TR |
1Mb/108P |
3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI | |
| W25Q256FVBIG |
1Mb/108P |
3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |