Engilsh
中文
한국어
Deutsch
日本語
Русский
Español
Français
Italiano
Português
polski
Tiếng Việt
W632GU6MB11 Wyniki wyszukiwania
Premium Dostawca
Dostawca
Shenzhen Augswan Electronics Co., LTD.
TOKYOSUPERDEVICECO.,LTD
Lvangchip(HongKong).,Limited
TIMICOMM Electronics
Semilex Distributor
HongDaElectronicsCo.LTD
Transcrui Microcircuit Corporation
Evatronix(HK) Electronics Trade Inc
Semilex Electronics Direct
Unitronix Electronics Inc.
YI FENG Electronics Inc.
YXS TECHNOLOGY CO.,LTD
NegoICCo.
ALL NEW SEMI Electronics Co., LIMITED
TIANHAO INDUSTRIAL CO.,LIMITED
Premium A
Element14
| Numer części | MFG | Arkusz danych | Opis | Rohs | Q'ty | Cena | Kup Teraz |
W6380-2PG-P-3DC
|
SWITCHCRAFT/CONXALL |  |
CIRCULAR CONNECTOR, PLUG, 2POS, CABLE; Product Range:Mini-Con-X Insta-Click Series; Circular Connect | ROHS COMPLIANT BY-EXEMPTION | 13 | 1+ : $27.09 10+ : $24.14 100+ : $18.6 250+ : $18.18 500+ : $17.4 1000+ : $17.06 |
Kup Teraz
|
W6380-2SG-P-528
|
SWITCHCRAFT/CONXALL | |
CIRCULAR CONNECTOR, PLUG, 2POS, CABLE; Product Range:Mini-Con-X Insta-Click Series; Circular Connect | ROHS COMPLIANT BY-EXEMPTION | 21 | 1+ : $23.96 10+ : $21.97 100+ : $17.87 250+ : $17.52 500+ : $17.32 1000+ : $16.98 |
Kup Teraz
|
Premium B
info
FEDERAL INDUSTRY CO.
Singapore
Tess@sunnlyic.com
| Numer części | MFG | Arkusz danych | Opis | Q'ty | Kod danych | Lokalizacja | Data reg | RFQ |
| W632GG6KB12I | WINBOND |
|
FBGA96 | 8295 | 20+PB | Pb-Free | 26-10-05 |
Zapytanie
|
| W632GG6MB-11 | WINBOND |
|
FBGA96 | 11088 | 20+PB | Pb-Free | 26-10-05 |
Zapytanie
|
| W632GG6MB-12 | WINBOND |
|
BGA96 | 15029 | 20+PB | Pb-Free | 26-10-05 |
Zapytanie
|
| W632GG6NB12I | WINBOND |
|
396 | 26-10-05 |
Zapytanie
|
info
IC Agent Electronics Ins
USA
Kevin@ic-agent.com
| Numer części | MFG | Arkusz danych | Opis | Q'ty | Kod danych | Lokalizacja | Data reg | RFQ |
| W632GU6MB12K | WINBOND |
|
BGA | 1360 | 2020+ | Instock | 26-10-05 |
Zapytanie
|
Podstawowy
| Dostawca | Numer części | MFG | Arkusz danych | Opis | Q'ty | Kod danych | Lokalizacja | Data reg | RFQ |
| TOKYOSUPERDEVICECO.,LTD | W632GU6MB11 | WINBOND |
|
198 | 1707 | 2025-02-27 |
Zapytanie
|
||
| Shenzhen Augswan Electronics Co., LTD. | W632GU6MB11I | Winbond El |
|
IC DRAM 2G PARALLEL 933MHZ | 8392 | 21+ | Stock | 2023-07-25 |
Zapytanie
|
| TIMICOMM Electronics [ info@timicomm.com ] | W632GU6MB11I | Winbond |
|
DRAM 2G PARALLEL 933MHZ | 86500 | 2022+ | NEW STOCK | 2026-01-06 |
Zapytanie
|
| Semilex Distributor [ sales@semi-lex.com ] | W632GU6MB11I | Winbond |
|
DRAM 2G PARALLEL 933MHZ | 174183 | 2019+ | Can ship immediately | 2024-09-25 |
Zapytanie
|
| HongDaElectronicsCo.LTD |
W632GU6MB11I
|
Winbond El |
|
IC DRAM 2G PARALLEL 933MHZ | 45120 | 2022 | In.USA.Stock | 2023-05-23 |
Zapytanie
|
| Transcrui Microcircuit Corporation | W632GU6MB11I | Winbond |
|
DRAM 2G PARALLEL 933MHZ | 59726 | 2022+ | Original instock，Rush delivery | 2024-09-23 |
Zapytanie
|
| Evatronix(HK) Electronics Trade Inc | W632GU6MB11I | Winbond |
|
2020+ | 2020+ | HOT SALES & GLOBAL | 2024-09-24 |
Zapytanie
|
|
| Lvangchip(HongKong).,Limited | W632GU6MB11I | WinbondEle |
|
SMD/DIP | 18800 | 23+ | Stock | 2024-03-06 |
Zapytanie
|
| Semilex Electronics Direct [ info@semi-lex.com ] | W632GU6MB11I | Winbond |
|
DRAM 2G PARALLEL 933MHZ | 174183 | 2020+ | Can ship immediately | 2026-09-29 |
Zapytanie
|
| Unitronix Electronics Inc. [sales@unitronix-e.com] | W632GU6MB11I | Winbond |
|
DRAM 2G PARALLEL 933MHZ | 47950 | 2020+ | HOT SALES | 2026-01-06 |
Zapytanie
|
| YI FENG Electronics Inc. | W632GU6MB11I | Winbond |
|
DRAM 2G PARALLEL 933MHZ | 42584 | 2022+ | New Stock,Rapid delivery | 2024-09-23 |
Zapytanie
|
| YXS TECHNOLOGY CO.,LTD | W632GU6MB11I | WinbondEle |
|
SDRAM-DDR3MemoryIC2Gb(128Mx16)Parallel933MHz20ns96-VFBGA(13x7.5) | 242895 | 22+ | HongKong | 2022-12-16 |
Zapytanie
|
| Shenzhen Augswan Electronics Co., LTD. | W632GU6MB11J | WINBOND |
|
FBGA | 10422 | 21+ | Stock | 2023-07-25 |
Zapytanie
|
| NegoICCo. |
W632GU6MB11J
|
WINBOND |
|
FBGA | 16666 | 2022+ | INSTOCK | 2026-08-21 |
Zapytanie
|
| Lvangchip(HongKong).,Limited | W632GU6MB11J | WinbondEle |
|
SMD/DIP | 18800 | 23+ | Stock | 2024-03-06 |
Zapytanie
|
| ALL NEW SEMI Electronics Co., LIMITED | W632GU6MB11K | WINBOND |
|
BGA | 250 | 2026-09-30 |
Zapytanie
|
||
| Shenzhen Augswan Electronics Co., LTD. | W632GU6MB11K | WINBOND |
|
BGA96 | 13840 | 21+ | Stock | 2023-07-25 |
Zapytanie
|
| TOKYOSUPERDEVICECO.,LTD | W632GU6MB11K | WINBOND |
|
250 | 1736+ | 2025-02-27 |
Zapytanie
|
||
| TIANHAO INDUSTRIAL CO.,LIMITED | W632GU6MB11KIC | WINBOND/ |
|
BGA96 | 10000 | 1736+ | 2023-05-16 |
Zapytanie
|
1
W632GU6MB11 Arkusz danych
| MFG | Numer części | Arkusz danych | Opis |
 Winbond |
W632GU6KB |
3Mb/160P |
16M X 8 BANKS X 16 BIT DDR3L SDRAM |
| W632GU6KB-11 |
3Mb/160P |
16M X 8 BANKS X 16 BIT DDR3L SDRAM | |
| W632GU6KB-12 |
3Mb/160P |
16M X 8 BANKS X 16 BIT DDR3L SDRAM | |
| W632GU6KB-15 |
3Mb/160P |
16M X 8 BANKS X 16 BIT DDR3L SDRAM | |
| W632GU6KB12I |
3Mb/160P |
16M X 8 BANKS X 16 BIT DDR3L SDRAM | |
| W632GU6KB15I |
3Mb/160P |
16M X 8 BANKS X 16 BIT DDR3L SDRAM |