Engilsh
中文
한국어
Deutsch
日本語
Русский
Español
Français
Italiano
Português
polski
Tiếng Việt
FI212E0829M3T Wyniki wyszukiwania
Premium Dostawca
Dostawca
NegoICCo.
RANTLE EAST ELECTRONIC > www.digsemi.com
Yiner(Shenzhen)Electronics Co., Ltd.
Andy(International)Electroni
Shenzhen Augswan Electronics Co., LTD.
ClicElectronicsCo.Limited
ePartronics
Fairsign Technology Limited
HAODE TECHNOLOGY CO.,LIMITED
IC Agent Electronics Ins
JAK ELECTRONICS LIMITED
JJK Electronics Co., Ltd
Leading(HK) IC Distributor Limited
TIANHAO INDUSTRIAL CO.,LIMITED
Wintech Components Limited
FEDERAL INDUSTRY CO.
Premium A
Element14
| Numer części | MFG | Arkusz danych | Opis | Rohs | Q'ty | Cena | Kup Teraz |
FI-100
|
TEMPO |  |
FIBRE IDENTIFIER, 800-1700NM; Kit Contents:250/900µm Adapter, 2/3mm Adapter, Soft Carry Case, Instru | NOT ROHS COMPLIANT | 1+ : $1,060.28 |
Kup Teraz
|
|
FI-500
|
FLUKE NETWORKS | |
KIT, FI-500 FIBERINSPECTOR, 9 PC; Connector Type:-; Photodetector Type:Indium Gallium Arsenide; Oper | ROHS COMPLIANT | 1 | 1+ : $4,743.54 |
Kup Teraz
|
Premium B
info
FEDERAL INDUSTRY CO.
Singapore
Tess@sunnlyic.com
| Numer części | MFG | Arkusz danych | Opis | Q'ty | Kod danych | Lokalizacja | Data reg | RFQ |
| FI212E0829M3-T | TAIYO |
|
SMD | 16933 | 20+PB | Pb-Free | 26-11-02 |
Zapytanie
|
info
IC Agent Electronics Ins
USA
Kevin@ic-agent.com
| Numer części | MFG | Arkusz danych | Opis | Q'ty | Kod danych | Lokalizacja | Data reg | RFQ |
| FI212E0829M3-T |
|
SMD | 12726 | 2020+ | Instock | 26-11-02 |
Zapytanie
|
Podstawowy
| Dostawca | Numer części | MFG | Arkusz danych | Opis | Q'ty | Kod danych | Lokalizacja | Data reg | RFQ |
| NegoICCo. |
FI212E0829M3
|
TAIYO |
|
SMD | 19999 | 2022+ | INSTOCK | 2026-08-21 |
Zapytanie
|
| RANTLE EAST ELECTRONIC > www.digsemi.com | FI212E0829M3 |
|
12500 | ICRFQ | 2025-07-24 |
Zapytanie
|
|||
| Yiner(Shenzhen)Electronics Co., Ltd. | FI212E0829M3 | TAIYO |
|
SMD | 959500 | 15+ | 959500 | 2017-06-10 |
Zapytanie
|
| Andy(International)Electroni | FI212E0829M3-T | TaiyoYuden |
|
28362 | 2018+ | 2026-11-02 |
Zapytanie
|
||
| Shenzhen Augswan Electronics Co., LTD. | FI212E0829M3-T | TaiyoYuden |
|
SMD | 4340 | 21+ | Stock | 2023-07-25 |
Zapytanie
|
| NegoICCo. |
FI212E0829M3-T
|
TAIYO |
|
SMD | 19999 | 2022+ | INSTOCK | 2026-08-21 |
Zapytanie
|
| ClicElectronicsCo.Limited | FI212E0829M3-T | TAIYOYUDEN |
|
SMD | 2500 | 16+ | 2025-06-04 |
Zapytanie
|
|
| ePartronics | FI212E0829M3-T | TAIYOYUDEN |
|
SMD | 60000 | 13+ | 2025-07-25 |
Zapytanie
|
|
| Fairsign Technology Limited | FI212E0829M3-T | TAIYO/ |
|
SMD | 99899 | 20+ | 2021-09-16 |
Zapytanie
|
|
| HAODE TECHNOLOGY CO.,LIMITED | FI212E0829M3-T | TaiyoYuden |
|
29516 | 2022+ | 2024-04-11 |
Zapytanie
|
||
| IC Agent Electronics Ins | FI212E0829M3-T |
|
SMD | 12726 | 2020+ | Instock | 2022-10-29 |
Zapytanie
|
|
| JAK ELECTRONICS LIMITED | FI212E0829M3-T | Original |
|
2500 | Stock | 2019-10-30 |
Zapytanie
|
||
| JJK Electronics Co., Ltd | FI212E0829M3-T | TAIYOYUDEN |
|
1750 | 2022-03-10 |
Zapytanie
|
|||
| Leading(HK) IC Distributor Limited | FI212E0829M3-T |
|
SMD | 90000 | 2019+ | INSTOCK | 2024-05-06 |
Zapytanie
|
|
| RANTLE EAST ELECTRONIC > www.digsemi.com | FI212E0829M3-T | TaiyoYuden |
|
27000 | ICRFQ | 2025-07-24 |
Zapytanie
|
||
| TIANHAO INDUSTRIAL CO.,LIMITED | FI212E0829M3-T |
|
SMD | 100000 | 2021 | 2023-05-16 |
Zapytanie
|
||
| Wintech Components Limited | FI212E0829M3-T |
|
SMD | 20000 | 2021+ | INSTOCK | 2023-10-18 |
Zapytanie
|
|
| FEDERAL INDUSTRY CO. | FI212E0829M3-T | TAIYO |
|
SMD | 16933 | 20+PB | Pb-Free | 2026-10-23 |
Zapytanie
|
1
FI212E0829M3T Arkusz danych
| MFG | Numer części | Arkusz danych | Opis |
 Taiyo Yuden (U.S.A.... |
FI212B190223-T |
236Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) |
| FI212B245026-T |
238Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) | |
| FI212B245027-T |
238Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) | |
| FI212B3750EQ-T |
242Kb/2P |
Multilayer Ceramic Devices (Band Pass Type)for 5G | |
| FI212B3750EQ-T |
296Kb/2P |
Multilayer Ceramic Devices (Band Pass Type)for 5G 2022.04.08 |
|
| FI212B4150HW-T |
299Kb/2P |
Multilayer Ceramic Devices (Band Pass Type)for 5G 2021.11.26 |
|
| FI212B4700DQ-T |
242Kb/2P |
Multilayer Ceramic Devices (Band Pass Type)for 5G | |
| FI212B4700DQ-T |
296Kb/2P |
Multilayer Ceramic Devices (Band Pass Type)for 5G 2022.04.08 |
|
| FI212C245033-T |
254Kb/2P |
Multilayer Ceramic Devices (Balance Type) | |
| FI212C245036-T |
254Kb/2P |
Multilayer Ceramic Devices (Balance Type) | |
| FI212C245075-T |
254Kb/2P |
Multilayer Ceramic Devices (Balance Type) | |
| FI212P082931-T |
249Kb/2P |
Multilayer Ceramic Devices (Diplexers) | |
| FI212P082934-T |
249Kb/2P |
Multilayer Ceramic Devices (Diplexers) | |
| FI212P082935-T |
249Kb/2P |
Multilayer Ceramic Devices (Diplexers) | |
| FI212P0829G2-T |
254Kb/2P |
Multilayer Ceramic Devices (Diplexers) | |
| FI212P0829G2-T |
309Kb/2P |
Multilayer Ceramic Devices (Diplexers) 2022.04.08 |
|
| FI212P0829H9-T |
331Kb/2P |
Multilayer Ceramic Devices (Diplexers)for 5G 2021.11.26 |
|
| FI212P0829JJ-T |
333Kb/2P |
Multilayer Ceramic Devices (Diplexers)for 5G 2021.11.26 |
|
| FI212P085909-T |
249Kb/2P |
Multilayer Ceramic Devices (Diplexers) | |
| FI212P085912-T |
249Kb/2P |
Multilayer Ceramic Devices (Diplexers) | |
| FI212P089208-T |
249Kb/2P |
Multilayer Ceramic Devices (Diplexers) | |
| FI212P089213-T |
249Kb/2P |
Multilayer Ceramic Devices (Diplexers) | |
| FI212P1700CL-T |
255Kb/2P |
Multilayer Ceramic Devices (Diplexers)for 5G | |
| FI212P1700CL-T |
310Kb/2P |
Multilayer Ceramic Devices (Diplexers)for 5G 2022.04.08 |
|
| FI212P1700HU-T |
304Kb/2P |
Multilayer Ceramic Devices (Diplexers)for 5G 2021.11.26 |
|
| FI212P1955EN-T |
257Kb/2P |
Multilayer Ceramic Devices (Diplexers)for 5G | |
| FI212P1955EN-T |
311Kb/2P |
Multilayer Ceramic Devices (Diplexers)for 5G 2022.04.08 |