| MFG |
부품 번호 |
데이터 시트 |
부품 설명 |
 Belden Inc. |
87760 |
148Kb/2P |
Electronic, 2 C #18 Str TC, FEP Ins, OS, PVDF Jkt, CMP 01-20-2023 |
 Molex Electronics L... |
87760-0006 |
101Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-0416 |
167Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-0417 |
166Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-0616 |
167Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-0617 |
166Kb/4P |
2.00mm (.079 0.76關m (30關") Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-0626 |
167Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Mating Length: 3.50mm (.138), 6 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray, Lead-free |
| 87760-0627 |
167Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Mating Length: 3.50mm (.138), 6 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray, Lead-free |
| 87760-0816 |
167Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-0817 |
166Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 8 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-0818 |
166Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 8 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
| 87760-0838 |
166Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 8 Circuits, 2.54關m (100關) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-free |
| 87760-1016 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-1017 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-1046 |
114Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-1216 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-1217 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-1218 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
| 87760-1226 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length: 3.50mm (.138), Tray, Lead-free |
| 87760-1236 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits 0.38關m (15關) Gold (Au) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-free |
| 87760-1268 |
103Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, 12 Circuits, 2.54關m (100關) Tin (Sn) over Nickel Plating, Tray, Lead-free |
| 87760-1416 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-1417 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-1616 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-1617 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-1618 |
172Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 16 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
| 87760-1816 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 18 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-1817 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 18 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free |
| 87760-1818 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 18 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
| 87760-2016 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |