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모든 결과 ( 3,314,868 )
4로 시작 ( 23,470 )
| 부품 번호 | MFG | 데이터 시트 | 부품 설명 | Q'ty | 데이터 코드 | 위치 | Reg 날짜 | RFQ |
| 4406 | AOFCK |
|
SOP-8 | 5918234 | 20+PB | Pb-Free | 26-09-24 |
문의
|
| 4406-10SR | MULTICOMP |
|
5119485 | 20+PB | Pb-Free | 26-09-24 |
문의
|
|
| 4406-20SR | MULTICOMP |
|
4193203 | 20+PB | Pb-Free | 26-09-24 |
문의
|
|
| 4406-34SR | MULTICOMP |
|
2486036 | 20+PB | Pb-Free | 26-09-24 |
문의
|
|
| 4406-50SR | MULTICOMP |
|
1600760 | 20+PB | Pb-Free | 26-09-24 |
문의
|
|
| 440671203 | MOLEX |
|
28406 | 20+PB | Pb-Free | 26-09-24 |
문의
|
|
| 440680004 | MOLEM |
|
SMD | 2800 | 20+PB | Pb-Free | 26-09-24 |
문의
|
| 440680045 | MOLEX |
|
9226 | 20+PB | Pb-Free | 26-09-24 |
문의
|
|
| 440680050 | MOLEX |
|
9926 | 20+PB | Pb-Free | 26-09-24 |
문의
|
|
| 44068-0001 | MOLEX |
|
NA | 210 | 20+PB | Pb-Free | 26-09-24 |
문의
|
| 44068-0004 | MOLEM |
|
SMD | 2800 | 20+PB | Pb-Free | 26-09-24 |
문의
|
1
4406 데이터 시트
| MFG | 부품 번호 | 데이터 시트 | 부품 설명 |
 Heyco. |
4406 |
70Kb/1P |
Push Rivet-Arrow |
 List of Unclassifed... |
44060 |
104Kb/1P |
PRIMARY VOLTAGE, Vacuum filling, Two compartments bobbins |
| 4406000400 |
2Mb/164P |
We are Dedicated to Achieving Customer Satisfaction Through Continuous Improvement | |
 Turck, Inc. |
44065 |
1Mb/3P |
Inductive Sensor 11/07/2023 |
| 4406551 |
1Mb/3P |
Inductive Sensor 11/07/2023 |
|
| 44067 |
1Mb/3P |
Inductive Sensor 11/07/2023 |
|
 Molex Electronics L... |
44067-0201 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") |
| 44067-0401 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | |
| 44067-0402 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | |
| 44067-0403 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76關m (30關") Gold (Au) Selective Plating | |
| 44067-0601 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating | |
| 44067-0602 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm | |
| 44067-0603 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | |
| 44067-0801 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | |
| 44067-0802 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick | |
| 44067-1001 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | |
| 44067-1002 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | |
| 44067-1003 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | |
| 44067-1201 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating | |
| 44067-1202 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | |
| 44067-1203 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76關m (30關") Gold (Au) Selective Plating | |
| 44067-1401 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | |
| 44067-1402 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header | |
| 44067-1403 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76關m (30關") Gold (Au) Selective Plating | |
| 44067-1601 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") | |
| 44067-1602 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | |
| 44067-1603 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating | |
| 44067-1801 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 18 Circuits, Tin (Sn) Plating | |
| 44067-1802 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB | |
| 44067-1803 |
216Kb/3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header |