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모든 결과 ( 3,314,868 )
3로 시작 ( 31,898 )
| 부품 번호 | MFG | 데이터 시트 | 부품 설명 | Q'ty | 데이터 코드 | 위치 | Reg 날짜 | RFQ |
| 33660473 | PHILIPS |
|
37576 | 20+PB | Pb-Free | 26-09-30 |
문의
|
|
| 3366W-1-102 | BOURNS |
|
DIP-3 | 584500 | 20+PB | Pb-Free | 26-09-30 |
문의
|
| 3366W-1-103 | BOURNS |
|
DIP-3 | 5985 | 20+PB | Pb-Free | 26-09-30 |
문의
|
| 3366W-1-104 | BOURNS |
|
DIP-3 | 4760 | 20+PB | Pb-Free | 26-09-30 |
문의
|
| 3366W-1-500 | BOURNS |
|
DIP-3 | 6440 | 20+PB | Pb-Free | 26-09-30 |
문의
|
| 3366W-1-501 | BOURNS |
|
DIP-3 | 154973 | 20+PB | Pb-Free | 26-09-30 |
문의
|
| 3366W-1-503 | BOURNS |
|
DIP-3 | 251300 | 20+PB | Pb-Free | 26-09-30 |
문의
|
| 3366X-1-102 | BOURNS |
|
DIP | 6650 | 20+PB | Pb-Free | 26-09-30 |
문의
|
| 3366X-1-202 | BOURNS |
|
DIP | 1211 | 20+PB | Pb-Free | 26-09-30 |
문의
|
| 3366X-1-203 | BOURNS |
|
DIP | 7945 | 20+PB | Pb-Free | 26-09-30 |
문의
|
| 3366X-1-502 | BOURNS |
|
DIP | 6300 | 20+PB | Pb-Free | 26-09-30 |
문의
|
| 3366X-1-504 | BOURNS |
|
DIP-3 | 42000 | 20+PB | Pb-Free | 26-09-30 |
문의
|
1
3366P1201 데이터 시트
| MFG | 부품 번호 | 데이터 시트 | 부품 설명 |
 Schurter Inc. |
3366 |
381Kb/3P |
Power Cord with IEC Connector C15, Straight, 120째C |
 List of Unclassifed... |
3366 |
68Kb/1P |
WASHERS |
| 3366 |
100Kb/1P |
Heyco짰 Nylon Cable Clamps | |
 Heyco. |
3366 |
84Kb/1P |
Nylon Cable Clamps |
 3M Electronics |
3366-1000 |
488Kb/4P |
3M D Ribbon Wiremount Plug |
| 3366-1000 |
235Kb/4P |
3M??D Ribbon Wiremount Plug | |
| 3366-1001 |
488Kb/4P |
3M D Ribbon Wiremount Plug | |
| 3366-1001 |
235Kb/4P |
3M??D Ribbon Wiremount Plug | |
| 3366-1002 |
488Kb/4P |
3M D Ribbon Wiremount Plug | |
| 3366-1002 |
235Kb/4P |
3M??D Ribbon Wiremount Plug | |
 KR Electronics, Inc... |
3366-1700-187 |
84Kb/3P |
KR Electronics part number 3361-1700-187 is a 1700 MHz Bandpass filter |
 Sumida Corporation |
3366-T177 |
97Kb/1P |
General Power Transformer |
 NXP Semiconductors |
33660 |
418Kb/13P |
ISO K line serial link interface Rev 6.0, 7/2016 |
 Motorola, Inc |
33661 |
377Kb/20P |
LIN Enhanced Physical Interface |
 Freescale Semicondu... |
33661 |
542Kb/21P |
Local Area Network (LIN) Enhanced Physical Interface with Selectable Slew Rate |
|
NXP Semiconductors |
33662 |
774Kb/31P |
ISO 17987/LIN 2.x/SAEJ2602-2 LIN Physical Layer Rev. 8.0, 12/2018 |
 Aavid, Thermal Divi... |
336624B00032G |
8Mb/116P |
Channel style heat sink with folded back fins |
| 336624B00032G |
8Mb/116P |
How to Use This Catalog | |
|
Freescale Semicondu... |
33663 |
828Kb/37P |
LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer |