| Mfg |
Numero parte |
Scheda dati |
Descrizione |
 Molex Electronics L... |
70246-0801 |
187Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.38關m (15關) Gold (Au) Selective Plating |
| 70246-0802 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-1001 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-1002 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-1004 |
188Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.13關m (5關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-1202 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 12Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-1401 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-1402 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-1404 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127關m (5關") Gold (Au) Plating, Tin (Sn) PC TailPlating |
| 70246-1601 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-1602 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-1604 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating |
| 70246-2001 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-2002 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-2004 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating |
| 70246-2401 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 24 Circuits, 0.38um (15u") Gold (Au) |
| 70246-2402 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-2501 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, Void |
| 70246-2601 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-2602 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-2604 |
187Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.127關m (5關) Gold (Au) Plating, Tin(Sn) PC Tail Plating |
| 70246-3001 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-3002 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-3004 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating |
| 70246-3401 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-3402 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-3404 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating |
| 70246-4001 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits |
| 70246-4002 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 70246-4004 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 40Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating |