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| Numéro d'article | MFG | Fiche de données | Description | Q'ty | Code de données | Emplacement | Date de régime | RFQ |
| 0015UH |
|
25000 | 2016+ | Instock | 26-09-18 |
Enquête
|
||
| 0015040343 | MOLEX |
|
New&Original | 85000 | 2019 | stockontime | 26-09-18 |
Enquête
|
| 0015917060+ | MOLEX |
|
NA | 4000 | 2020+ | Instock | 26-09-18 |
Enquête
|
| 0015UF2000V |
|
25000 | 2016+ | Instock | 26-09-18 |
Enquête
|
||
| 0015911608ND | RoHs |
|
Original&New | 20000 | 2016+ | Instock | 26-09-18 |
Enquête
|
| 0000-0002-0015 | DILCO |
|
3738 | 2020+ | Instock | 26-09-18 |
Enquête
|
|
| 0402-0015-55-F | BEL |
|
1736 | 121904 | 2020+ | Instock | 26-09-18 |
Enquête
|
| 0402-0015-75-F | BEL |
|
1736 | 121904 | 2020+ | Instock | 26-09-18 |
Enquête
|
| 0402-0015-82-F | BEL |
|
1736 | 121904 | 2020+ | Instock | 26-09-18 |
Enquête
|
| 0402-0015-93-F | BEL |
|
1736 | 121904 | 2020+ | Instock | 26-09-18 |
Enquête
|
| 0403-0015-50-F | BEL |
|
1736 | 121904 | 2020+ | Instock | 26-09-18 |
Enquête
|
1
0015802 Fiche de données
| MFG | Numéro d'article | Fiche de données | Description |
 Molex Electronics L... |
001580-0307 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
| 001580-0407 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | |
| 001580-0489 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | |
| 001580-1123 |
32Kb/2P |
2.54mm Pitch C-Grid짰 Header | |
| 001580-1143 |
32Kb/2P |
2.54mm Pitch C-Grid짰 Header | |
| 001580-1163 |
31Kb/2P |
2.54mm Pitch C-Grid짰 Header | |
| 001580-1181 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | |
| 001580-1241 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | |
| 001580-1261 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | |
| 001580-1321 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | |
| 001580-1324 |
31Kb/2P |
2.54mm Pitch C-Grid짰 Header | |
| 001580-1341 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | |
| 001580-1361 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | |
| 0015800061 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | |
| 0015800061_17 |
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical | |
| 0015800063 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating | |
| 0015800063_17 |
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical | |
| 0015800065 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating | |
| 0015800065_17 |
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical | |
| 0015800067 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | |
| 0015800067_17 |
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical | |
| 0015800069 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating | |
| 0015800069_17 |
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical | |
| 0015800081 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating | |
| 0015800081_17 |
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical | |
| 0015800083 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating | |
| 0015800083_17 |
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical | |
| 0015800085 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76關m (30關) Gold (Au) Selective Plating | |
| 0015800085_17 |
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical | |
| 0015800087 |
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating |