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W632GU6MB11 Suchergebnisse
Premium Anbieter
Anbieter
Shenzhen Augswan Electronics Co., LTD.
TOKYOSUPERDEVICECO.,LTD
Lvangchip(HongKong).,Limited
TIMICOMM Electronics
Semilex Distributor
HongDaElectronicsCo.LTD
Transcrui Microcircuit Corporation
Evatronix(HK) Electronics Trade Inc
Semilex Electronics Direct
Unitronix Electronics Inc.
YI FENG Electronics Inc.
YXS TECHNOLOGY CO.,LTD
NegoICCo.
ALL NEW SEMI Electronics Co., LIMITED
TIANHAO INDUSTRIAL CO.,LIMITED
Premium A
Element14
| Artikelnummer | Mfg | Datenblatt | Beschreibung | Rohs | Q'ty | Preis | Kaufe jetzt |
W6380-2PG-P-3DC
|
SWITCHCRAFT/CONXALL |  |
CIRCULAR CONNECTOR, PLUG, 2POS, CABLE; Product Range:Mini-Con-X Insta-Click Series; Circular Connect | ROHS COMPLIANT BY-EXEMPTION | 13 | 1+ : $27.09 10+ : $24.14 100+ : $18.6 250+ : $18.18 500+ : $17.4 1000+ : $17.06 |
Kaufe jetzt
|
W6380-2SG-P-528
|
SWITCHCRAFT/CONXALL | |
CIRCULAR CONNECTOR, PLUG, 2POS, CABLE; Product Range:Mini-Con-X Insta-Click Series; Circular Connect | ROHS COMPLIANT BY-EXEMPTION | 21 | 1+ : $23.96 10+ : $21.97 100+ : $17.87 250+ : $17.52 500+ : $17.32 1000+ : $16.98 |
Kaufe jetzt
|
Premium B
info
FEDERAL INDUSTRY CO.
Singapore
Tess@sunnlyic.com
| Artikelnummer | Mfg | Datenblatt | Beschreibung | Q'ty | Datencode | Standort | Reg -Datum | RFQ |
| W632GG6KB12I | WINBOND |
|
FBGA96 | 8295 | 20+PB | Pb-Free | 26-10-23 |
Anfrage
|
| W632GG6MB-11 | WINBOND |
|
FBGA96 | 11088 | 20+PB | Pb-Free | 26-10-23 |
Anfrage
|
| W632GG6MB-12 | WINBOND |
|
BGA96 | 15029 | 20+PB | Pb-Free | 26-10-23 |
Anfrage
|
| W632GG6NB12I | WINBOND |
|
396 | 26-10-23 |
Anfrage
|
info
IC Agent Electronics Ins
USA
Kevin@ic-agent.com
| Artikelnummer | Mfg | Datenblatt | Beschreibung | Q'ty | Datencode | Standort | Reg -Datum | RFQ |
| W632GU6MB12K | WINBOND |
|
BGA | 1360 | 2020+ | Instock | 26-10-23 |
Anfrage
|
Basic
| Anbieter | Artikelnummer | Mfg | Datenblatt | Beschreibung | Q'ty | Datencode | Standort | Reg -Datum | RFQ |
| TOKYOSUPERDEVICECO.,LTD | W632GU6MB11 | WINBOND |
|
198 | 1707 | 2025-02-27 |
Anfrage
|
||
| Shenzhen Augswan Electronics Co., LTD. | W632GU6MB11I | Winbond El |
|
IC DRAM 2G PARALLEL 933MHZ | 8392 | 21+ | Stock | 2023-07-25 |
Anfrage
|
| TIMICOMM Electronics [ info@timicomm.com ] | W632GU6MB11I | Winbond |
|
DRAM 2G PARALLEL 933MHZ | 86500 | 2022+ | NEW STOCK | 2026-01-06 |
Anfrage
|
| Semilex Distributor [ sales@semi-lex.com ] | W632GU6MB11I | Winbond |
|
DRAM 2G PARALLEL 933MHZ | 174183 | 2019+ | Can ship immediately | 2024-09-25 |
Anfrage
|
| HongDaElectronicsCo.LTD |
W632GU6MB11I
|
Winbond El |
|
IC DRAM 2G PARALLEL 933MHZ | 45120 | 2022 | In.USA.Stock | 2023-05-23 |
Anfrage
|
| Transcrui Microcircuit Corporation | W632GU6MB11I | Winbond |
|
DRAM 2G PARALLEL 933MHZ | 59726 | 2022+ | Original instock，Rush delivery | 2024-09-23 |
Anfrage
|
| Evatronix(HK) Electronics Trade Inc | W632GU6MB11I | Winbond |
|
2020+ | 2020+ | HOT SALES & GLOBAL | 2024-09-24 |
Anfrage
|
|
| Lvangchip(HongKong).,Limited | W632GU6MB11I | WinbondEle |
|
SMD/DIP | 18800 | 23+ | Stock | 2024-03-06 |
Anfrage
|
| Semilex Electronics Direct [ info@semi-lex.com ] | W632GU6MB11I | Winbond |
|
DRAM 2G PARALLEL 933MHZ | 174183 | 2020+ | Can ship immediately | 2026-09-29 |
Anfrage
|
| Unitronix Electronics Inc. [sales@unitronix-e.com] | W632GU6MB11I | Winbond |
|
DRAM 2G PARALLEL 933MHZ | 47950 | 2020+ | HOT SALES | 2026-01-06 |
Anfrage
|
| YI FENG Electronics Inc. | W632GU6MB11I | Winbond |
|
DRAM 2G PARALLEL 933MHZ | 42584 | 2022+ | New Stock,Rapid delivery | 2024-09-23 |
Anfrage
|
| YXS TECHNOLOGY CO.,LTD | W632GU6MB11I | WinbondEle |
|
SDRAM-DDR3MemoryIC2Gb(128Mx16)Parallel933MHz20ns96-VFBGA(13x7.5) | 242895 | 22+ | HongKong | 2022-12-16 |
Anfrage
|
| Shenzhen Augswan Electronics Co., LTD. | W632GU6MB11J | WINBOND |
|
FBGA | 10422 | 21+ | Stock | 2023-07-25 |
Anfrage
|
| NegoICCo. |
W632GU6MB11J
|
WINBOND |
|
FBGA | 16666 | 2022+ | INSTOCK | 2026-08-21 |
Anfrage
|
| Lvangchip(HongKong).,Limited | W632GU6MB11J | WinbondEle |
|
SMD/DIP | 18800 | 23+ | Stock | 2024-03-06 |
Anfrage
|
| ALL NEW SEMI Electronics Co., LIMITED | W632GU6MB11K | WINBOND |
|
BGA | 250 | 2026-10-19 |
Anfrage
|
||
| Shenzhen Augswan Electronics Co., LTD. | W632GU6MB11K | WINBOND |
|
BGA96 | 13840 | 21+ | Stock | 2023-07-25 |
Anfrage
|
| TOKYOSUPERDEVICECO.,LTD | W632GU6MB11K | WINBOND |
|
250 | 1736+ | 2025-02-27 |
Anfrage
|
||
| TIANHAO INDUSTRIAL CO.,LIMITED | W632GU6MB11KIC | WINBOND/ |
|
BGA96 | 10000 | 1736+ | 2023-05-16 |
Anfrage
|
1
W632GU6MB11 Datenblatt
| Mfg | Artikelnummer | Datenblatt | Beschreibung |
 Winbond |
W632GU6KB |
3Mb/160P |
16M X 8 BANKS X 16 BIT DDR3L SDRAM |
| W632GU6KB-11 |
3Mb/160P |
16M X 8 BANKS X 16 BIT DDR3L SDRAM | |
| W632GU6KB-12 |
3Mb/160P |
16M X 8 BANKS X 16 BIT DDR3L SDRAM | |
| W632GU6KB-15 |
3Mb/160P |
16M X 8 BANKS X 16 BIT DDR3L SDRAM | |
| W632GU6KB12I |
3Mb/160P |
16M X 8 BANKS X 16 BIT DDR3L SDRAM | |
| W632GU6KB15I |
3Mb/160P |
16M X 8 BANKS X 16 BIT DDR3L SDRAM |