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W25X10CLSNIGTR Suchergebnisse
Premium Anbieter
Anbieter
ALL NEW SEMI Electronics Co., LIMITED
Shenzhen Boshuo Technology Development Co., Ltd
NegoICCo.
E-core Electronics CO. info@ecoreic.com
HongDaElectronicsCo.LTD
IC Agent Electronics Ins
CHINA KAIVO ELECTRONICS CO.,LTD
深圳市科芯奇电子有限公司
LENKEY ELECTRONICS (HK) CO.,LTD
Lvangchip(HongKong).,Limited
HongKongTeyouHuichengElectroni
YXS TECHNOLOGY CO.,LTD
Premium A
Element14
| Artikelnummer | Mfg | Datenblatt | Beschreibung | Rohs | Q'ty | Preis | Kaufe jetzt |
W2503
|
PERFORMANCE TOOLS |  |
Impact Driver Set; Kit Contents:Screwdri; Impact Driver Set; Kit Contents:Screwdriver Set(Phillips, | NOT APPLICABLE | 1+ : $29.12 |
Kaufe jetzt
|
Premium B
info
FEDERAL INDUSTRY CO.
Singapore
Tess@sunnlyic.com
| Artikelnummer | Mfg | Datenblatt | Beschreibung | Q'ty | Datencode | Standort | Reg -Datum | RFQ |
W25X10CLSNIG
|
WINBOND |
|
SOIC | 9905 | 20+PB | Pb-Free | 26-10-30 |
Anfrage
|
info
IC Agent Electronics Ins
USA
Kevin@ic-agent.com
| Artikelnummer | Mfg | Datenblatt | Beschreibung | Q'ty | Datencode | Standort | Reg -Datum | RFQ |
| W25X10CLSNIGTR | WINBOND |
|
8-SOIC | 357 | 20+PB | Pb-Free | 26-10-30 |
Anfrage
|
Basic
| Anbieter | Artikelnummer | Mfg | Datenblatt | Beschreibung | Q'ty | Datencode | Standort | Reg -Datum | RFQ |
| ALL NEW SEMI Electronics Co., LIMITED | W25X10CLSNIGTR | WINBOND |
|
SOP | 2146 | 2026-10-19 |
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|
||
| Shenzhen Boshuo Technology Development Co., Ltd | W25X10CLSNIGTR | WINBOND |
|
SOP8 | 3000 | 2212+ | 2024-09-22 |
Anfrage
|
|
| NegoICCo. |
W25X10CLSNIGTR
|
WINBOND |
|
SOP-8 | 10000 | 2022+ | INSTOCK | 2026-08-21 |
Anfrage
|
| E-core Electronics CO. info@ecoreic.com | W25X10CLSNIGTR | WINBOND |
|
8-SOIC | 5406 | Stock | 2017-01-10 |
Anfrage
|
|
| HongDaElectronicsCo.LTD | W25X10CLSNIGTR | WinbondEle |
|
ICFLASH1MSPI104MHZ8SOIC | 45120 | 2020 | In.USA.Stock | 2023-05-23 |
Anfrage
|
| IC Agent Electronics Ins | W25X10CLSNIGTR | WINBOND |
|
8-SOIC | 357 | 20+PB | Pb-Free | 2022-10-29 |
Anfrage
|
| CHINA KAIVO ELECTRONICS CO.,LTD | W25X10CLSNIGTR | WinbondEle |
|
8-SOIC | 18000 | 19+ | 2026-10-27 |
Anfrage
|
|
| 深圳市科芯奇电子有限公司 | W25X10CLSNIGTR | Winbond |
|
SOP8 | 6934 | 21+ | 2022-08-09 |
Anfrage
|
|
| LENKEY ELECTRONICS (HK) CO.,LTD | W25X10CLSNIGTR | WinbondEle |
|
8-SOIC | 36500 | 18+ | 2026-10-27 |
Anfrage
|
|
| Lvangchip(HongKong).,Limited | W25X10CLSNIGTR | WinbondEle |
|
SMD/DIP | 18800 | 23+ | Stock | 2024-03-06 |
Anfrage
|
| HongKongTeyouHuichengElectroni | W25X10CLSNIGTR | Winbond |
|
SOP8/3.9MM | 45000 | 22+ | stock | 2026-03-19 |
Anfrage
|
| YXS TECHNOLOGY CO.,LTD |
W25X10CLSNIGTR
|
WinbondEle |
|
FLASHMemoryIC1Mb(128Kx8)SPI104MHz8-SOIC | 266499 | 22+ | HongKong | 2022-12-16 |
Anfrage
|
1
W25X10CLSNIGTR Datenblatt
| Mfg | Artikelnummer | Datenblatt | Beschreibung |
 Winbond |
W25X10CLSNIG |
1Mb/51P |
2.5 / 3 / 3.3 V 512K / 1M / 2M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI |
| W25X10CLSNIG |
1Mb/47P |
1M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI |