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48869302 Search resultsC
Premium C
| Part # | Mfg | Datasheet | Description | Q'ty | Datacode | Location | Reg Date | Supplier | RFQ |
4886
|
SI |
|
SOP-8 | 223971 | 2022+ | INSTOCK | 24-06-09 | Nego IC Co. |
Inquiry
|
|
4886-227G
|
MG Chemica |
|
SOLDER RA 63/37 .040 1/2 LBS | 45120 | 2022 | In.USA.Stock | 24-06-09 | Hong Da Electronics Co.LTD |
Inquiry
|
|
4886-454G
|
MG Chemica |
|
SOLDER RA 63/37 1 LB | 45120 | 2022 | In.USA.Stock | 24-06-09 | Hong Da Electronics Co.LTD |
Inquiry
|
|
48860-1
|
TE Connect |
|
DIE AMPLI-BOND 69066 #4 | 45120 | 2022 | In.USA.Stock | 24-06-09 | Hong Da Electronics Co.LTD |
Inquiry
|
|
4886043V01
|
NDK |
|
224000 | 2022+ | INSTOCK | 24-06-09 | Nego IC Co. |
Inquiry
|
|
|
48861-1
|
TE Connect |
|
TOOL DIE AMPLI-BOND 69066 2AWG | 45120 | 2022 | In.USA.Stock | 24-06-09 | Hong Da Electronics Co.LTD |
Inquiry
|
|
4886267N0140.96MHZ
|
NDK |
|
SMD | 10000 | 2022+ | 24-06-09 | Nego IC Co. |
Inquiry
|
|
|
488645V89
|
NA |
|
NA | 10000 | 2022+ | 24-06-09 | Nego IC Co. |
Inquiry
|
|
| 488660000 | Weidmuller |
|
CONN TERM BLOCK 5.08MM 3POS OR | 65800 | 2020 | In.USA.Stock | 24-06-09 | Hong Da Electronics Co.LTD |
Inquiry
|
| 4886815H03 | NDK |
|
BGA | 300 | 13-14+ | INSTOCK | 24-06-09 | Nego IC Co. |
Inquiry
|
|
4886815H03-61.44M
|
NDK |
|
223988 | 2022+ | INSTOCK | 24-06-09 | Nego IC Co. |
Inquiry
|
|
|
48869718
|
N/A |
|
Originalnew | 18000 | 2016+ | Instock | 24-06-09 | IC Agent Electronics Ins |
Inquiry
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48869718
|
N/A |
|
Originalnew | 33550 | 2016 | Instock | 24-06-09 | FEDERAL INDUSTRY CO. |
Inquiry
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|
4886E
|
|
SOP-8 | 223967 | 2022+ | INSTOCK | 24-06-09 | Nego IC Co. |
Inquiry
|
|
|
4886SOP8
|
- |
|
224148 | 2022+ | INSTOCK | 24-06-09 | Nego IC Co. |
Inquiry
|
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